Lab equipment includes:

Sensor Functionalization

• Spin Coater for uniformly spreading solvents onto vacuum mounted 2-D substrates (≤ 4-inch)
• O2 Plasma Etcher for PDMS-glass bonding, wafer cleaning, and surface treatment
  • 13.56MHz high frequency
  • 0- to 150-watt rf power supply

Packaging & Prototyping

• Prusa Mk4 Printers for extruding melted thermoplastic materials (i.e. PLA, PETG, ASA, and ABS) layer-by-layer
  • 0.01mm XY and 50 µm Z resolution
• Resin-Based 3D Printers for using UV liht to cure microfluidic devices and biocompatible packages
  • 30 µm XY resolution

PCB Manufacturing 

• Multi-Press S4 System for enabling the fabrication of multilayer PCB prototypes, up to 8 layers
• Contac S4 System for enabling through-hole electroplating to electrically connect PCB layers
  • Material: Copper

Solution Preparation

• Microbalance Scale for measuring the mass of dry and wet contents
  • Weighing capabity: 160 g
  • Readability: 0.1 mg
• Deionized and Reverse Osmosis Water System for solution preparation and cleaning with purified water
  • 18.2MΩ DI, 10MΩ RO
• Dessicator for storing and outgassing contents under dry vacuum
• 80C Incubator Box for thermally curing and baking polymers and epoxies
  • Can maintain specific temperatures optimal for biological growth 

Test & Evaluation

• Power Supply and Oscilloscope for creating and visualizing device electrical signals 
  • Power Supply - max 30 V and 5A
• Stereomicroscope and Camera for magnifying and capturing images to PC
  • Provides 3.5X-180X magnification
• Benchtop Potentiostat for performing electrochemistry 
  • Applications: Sensor development, corrosion monitoring, energy converstion, and electrodeposition 

Lab contact:

Justin Stine
jmstine@umd.edu